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White Electronic Designs
Corporation provides leading edge, highly integrated silicon and advanced
packaging services that fit the immediate needs of today’s engineers. We
have extensive experience in advanced semiconductor packaging,
high-density memory chip products and state-of-the-art microelectronic
multi-chip modules. Our MCPs consist of multiple silicon die, mounted on a
microcircuit laminate within the confines of a defined molded package
providing the density and organization required to meet design needs. We
offer a variety of memory configurations utilizing ceramic, hermetic
packages and plastic encapsulated microcircuits.
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THINK
COMMUNICATIONS™,